On March 12, 2025, the Applied Electromagnetics Research Area hosted an insightful seminar titled "Enhanced Wireless Inter-Chip Communication Performance Using Symmetrical Layers and Soft/Hard Surface Concepts," presented by Dr. Yazan Al-Alem. The session focused on the crucial role of electrical interconnects in integrated circuits (ICs) and their growing challenges as operating frequencies continue to rise. Issues such as higher losses, RC delays, and mutual coupling pose significant obstacles to system performance, prompting the need for innovative solutions.

Dr. Al-Alem highlighted wireless interconnects as a promising alternative, offering new avenues to overcome these limitations. The seminar explored advanced techniques, including symmetrical layers, soft/hard surfaces, and electromagnetic bandgap (EBG) structures, which help minimize interference and efficiently direct radiated energy to receiving antennas. These advancements contribute to lower losses and enhanced system performance, making them vital for next-generation electronic systems.

The event encouraged active participation from students and researchers, fostering insightful discussions on the future of high-frequency interconnects. By bridging theoretical advancements with practical applications, the seminar underscored the importance of continuous innovation in wireless communication technologies.